SEMES (CEO Tae-Gyeong Chung), the largest semiconductor and display manufacturing equipment manufacturer in Korea,

announced on the 3rd that it is developing and mass-producing next-generation bonding equipment needed to manufacture HBM (High Bandwidth Memory).

The HBM Thermal Compression Bonder, which is currently being mass-produced by SEMES,

is a device that vertically stacks semiconductor chips manufactured by advanced silicon through electrode (TSV) method

on wafers to make HBM essential for AI semiconductor production.?

The equipment has the capability and performance to optimally respond to the increase in microbumps

due to the recent trend of HBM, the miniaturization of the input-out pitch.

In particular, high stacking precision was implemented even under high loads through position alignment, heat,

and pressure adjustment during the bonding process, and high productivity was secured by applying

the optimized bonding method to HBM manufactured by the NCF (nonconductive insulating film) method.?

SEMES TC Bonder aims to generate more than 250 billion KRW in sales this year, following 100 billion KRW in sales last year.?

In addition, the company said it is currently developing and evaluating a high-precision, high-acid hybrid bonder that

can connect chips in a stack without a separate connection terminal in preparation for ultra-fine processes after HBM4.

CEO Tae-Gyeong Chung said, "With the development of hybrid bonder that combines various semiconductor process technologies,

we have the best competitiveness in this field. We will achieve sales growth in recognition of facility quality and reliability."